Abstract
In this paper, we describe the development of a theoretical field-based or “wave” model which we are employing in an attempt to characterize the ground/power plane (e.g., the Vcc plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.
Original language | English (US) |
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Pages (from-to) | 300-303 |
Number of pages | 4 |
Journal | IEEE Transactions on Instrumentation and Measurement |
Volume | 44 |
Issue number | 2 |
DOIs | |
State | Published - Apr 1995 |
ASJC Scopus subject areas
- Instrumentation
- Electrical and Electronic Engineering