In this paper, we describe the development of a theoretical field-based or “wave” model which we are employing in an attempt to characterize the ground/power plane (e.g., the Vcc plane) structure of a printed wiring board (PWB) or multichip module (MCM). A brief development of the model is presented, followed by simulation results and insight into the noise phenomena. A test structure and electrical measurements are used to confirm the correctness and applicability of the model.
|Original language||English (US)|
|Number of pages||4|
|Journal||IEEE Transactions on Instrumentation and Measurement|
|State||Published - Apr 1995|
ASJC Scopus subject areas
- Electrical and Electronic Engineering