The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

Guang Wen Pan, Jeffrey A. Prentice, Sharon K. Zahn, Andrew J. Staniszewski, Barry Kent Gilbert, Barry K. Gilbert

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The development of a comprehensive electromagnetic (EM) modeling tool, the Networking Algorithm, is discussed. This tool is capable of simulating on a digital computer the complexities inherent in real-world interconnects and packages, including simultaneous treatment of the effects of mixed types of transmission line interconnects (i.e., mixtures of stripline, microstrip, and coplanar lines), stubs and branches, reflections, and crosstalk between multiple nets. The type of modeling tool which has been developed is described, the mathematics of the Networking Algorithm is discussed, and a number of examples taken from a high-frequency digital package design are given to show how such a computer-based EM modeling tool set can assist in the design of high-performance packages.

Original languageEnglish (US)
Pages (from-to)465-477
Number of pages13
JournalIEEE transactions on components, hybrids, and manufacturing technology
Volume15
Issue number4
DOIs
StatePublished - Aug 1992

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Multichip modules
Digital computers
Crosstalk
Electric lines

ASJC Scopus subject areas

  • Engineering(all)

Cite this

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules. / Pan, Guang Wen; Prentice, Jeffrey A.; Zahn, Sharon K.; Staniszewski, Andrew J.; Gilbert, Barry Kent; Gilbert, Barry K.

In: IEEE transactions on components, hybrids, and manufacturing technology, Vol. 15, No. 4, 08.1992, p. 465-477.

Research output: Contribution to journalArticle

Pan, Guang Wen ; Prentice, Jeffrey A. ; Zahn, Sharon K. ; Staniszewski, Andrew J. ; Gilbert, Barry Kent ; Gilbert, Barry K. / The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules. In: IEEE transactions on components, hybrids, and manufacturing technology. 1992 ; Vol. 15, No. 4. pp. 465-477.
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