TY - GEN
T1 - System level approach for assessing and mitigating differential skew for 10+ Gbps SerDes applications
AU - Degerstrom, Michael J.
AU - Buhrow, Benjamin R.
AU - McCoy, Bart O.
AU - Zabinski, Patrick J.
AU - Gilbert, Barry K.
AU - Daniel, Erik S.
PY - 2008
Y1 - 2008
N2 - Weave-induced skew on printed wiring boards (PWB) for 10+ Gbps SerDes data rates can be very significant. In this paper, we not only investigate weave-induced skew but also look at other sources of skew. We show the weave skew results taken from measurements of three different test boards. Results from a fourth board are presented to examine PWB differential via skew. Measurements from a fifth board are analyzed to determine total channel skew. We propose a budget such that a certain amount of skew can be tolerated with a small increase in channel insertion loss. We then present a case study to project overall performance on PWB yield. We observe a number of anomalies with our test results and suggest additional studies to guard against unpredicted high skew.
AB - Weave-induced skew on printed wiring boards (PWB) for 10+ Gbps SerDes data rates can be very significant. In this paper, we not only investigate weave-induced skew but also look at other sources of skew. We show the weave skew results taken from measurements of three different test boards. Results from a fourth board are presented to examine PWB differential via skew. Measurements from a fifth board are analyzed to determine total channel skew. We propose a budget such that a certain amount of skew can be tolerated with a small increase in channel insertion loss. We then present a case study to project overall performance on PWB yield. We observe a number of anomalies with our test results and suggest additional studies to guard against unpredicted high skew.
UR - http://www.scopus.com/inward/record.url?scp=51349160281&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51349160281&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2008.4550021
DO - 10.1109/ECTC.2008.4550021
M3 - Conference contribution
AN - SCOPUS:51349160281
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 513
EP - 520
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -