Full wave analysis of transmission lines in a multilayer substrate with heavy dielectric losses

Jilin Tan, Guang Wen Pan, Guang Tsai Lei, Barry Kent Gilbert

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

The worldwide CMOS integrated circuits industry relies on heavily doped silicon wafers as the starting material for chip fabrication; the resulting integrated circuits are confined to the upper few microns of the wafer, which itself is as much as 600-μm thick. These heavily doped silicon substrates are not insulators, but are actually very lossy; a loss tangent of 105 at 1 MHz is a fairly typical characteristic of the wafers. Although it is becoming increasingly necessary to model accurately the currents which flow between transistors and interconnects into the substrates, existing computer-aided design (CAD) simulation packages fail to provide accurate results in modeling such heavy dielectric losses, because most CAD packages rely on small perturbation methods in the analysis of dielectric losses. In this paper, the problem of computing the electrical behavior of lossy dielectrics is analyzed by the full wave method, and the mutual capacitances of transmission lines above such heavily doped CMOS substrates are computed and compared with laboratory experimental measurements. Good agreement between analytical and measurement results has been obtained.

Original languageEnglish (US)
Pages (from-to)621-627
Number of pages7
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part B
Volume19
Issue number3
DOIs
StatePublished - Aug 1996

Fingerprint

Dielectric losses
Electric lines
Multilayers
Computer aided design
Substrates
CMOS integrated circuits
Silicon wafers
Integrated circuits
Transistors
Capacitance
Fabrication
Silicon
Industry

Keywords

  • CMOS
  • Full wave
  • Green's function
  • Impedance
  • Integral equation
  • Reflection
  • Transmission

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Full wave analysis of transmission lines in a multilayer substrate with heavy dielectric losses. / Tan, Jilin; Pan, Guang Wen; Lei, Guang Tsai; Gilbert, Barry Kent.

In: IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Vol. 19, No. 3, 08.1996, p. 621-627.

Research output: Contribution to journalArticle

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