Electronic packaging for 10-100 Gb/s OE systems

G. Fokken, E. Daniel, M. Degerstrom, T. Schaefer, P. Zabinski, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electronic packaging for 10-100 Gb/s optoelectronic (OE) circuits was discussed. Signal integrity and power/ground delivery issues crucial in designing multi-GHz packaging to prevent system failure were addressed. The minimization of discontinuities in controlled-impedance signal interconnect and extention of present packaging fabrication and assembly technology to higher frequency operation were also analyzed.

Original languageEnglish (US)
Title of host publicationConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Pages861-862
Number of pages2
Volume2
StatePublished - 2001
Event14th Annual Meeting of the IEEE Lasers and Electro-Optics Society - San Diego, CA, United States
Duration: Nov 11 2001Nov 15 2001

Other

Other14th Annual Meeting of the IEEE Lasers and Electro-Optics Society
CountryUnited States
CitySan Diego, CA
Period11/11/0111/15/01

Fingerprint

Electronics packaging
Optoelectronic devices
Packaging
Fabrication
Networks (circuits)

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Fokken, G., Daniel, E., Degerstrom, M., Schaefer, T., Zabinski, P., & Gilbert, B. K. (2001). Electronic packaging for 10-100 Gb/s OE systems. In Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS (Vol. 2, pp. 861-862)

Electronic packaging for 10-100 Gb/s OE systems. / Fokken, G.; Daniel, E.; Degerstrom, M.; Schaefer, T.; Zabinski, P.; Gilbert, Barry Kent.

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. Vol. 2 2001. p. 861-862.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fokken, G, Daniel, E, Degerstrom, M, Schaefer, T, Zabinski, P & Gilbert, BK 2001, Electronic packaging for 10-100 Gb/s OE systems. in Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. vol. 2, pp. 861-862, 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society, San Diego, CA, United States, 11/11/01.
Fokken G, Daniel E, Degerstrom M, Schaefer T, Zabinski P, Gilbert BK. Electronic packaging for 10-100 Gb/s OE systems. In Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. Vol. 2. 2001. p. 861-862
Fokken, G. ; Daniel, E. ; Degerstrom, M. ; Schaefer, T. ; Zabinski, P. ; Gilbert, Barry Kent. / Electronic packaging for 10-100 Gb/s OE systems. Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS. Vol. 2 2001. pp. 861-862
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