Abstract
Electronic packaging for 10-100 Gb/s optoelectronic (OE) circuits was discussed. Signal integrity and power/ground delivery issues crucial in designing multi-GHz packaging to prevent system failure were addressed. The minimization of discontinuities in controlled-impedance signal interconnect and extention of present packaging fabrication and assembly technology to higher frequency operation were also analyzed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 861-862 |
| Number of pages | 2 |
| Journal | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS |
| Volume | 2 |
| State | Published - 2001 |
| Event | 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society - San Diego, CA, United States Duration: Nov 11 2001 → Nov 15 2001 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering