Electronic packaging for 10-100 Gb/s OE systems

G. Fokken, E. Daniel, M. Degerstrom, T. Schaefer, P. Zabinski, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electronic packaging for 10-100 Gb/s optoelectronic (OE) circuits was discussed. Signal integrity and power/ground delivery issues crucial in designing multi-GHz packaging to prevent system failure were addressed. The minimization of discontinuities in controlled-impedance signal interconnect and extention of present packaging fabrication and assembly technology to higher frequency operation were also analyzed.

Original languageEnglish (US)
Title of host publicationConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Pages861-862
Number of pages2
Volume2
StatePublished - 2001
Event14th Annual Meeting of the IEEE Lasers and Electro-Optics Society - San Diego, CA, United States
Duration: Nov 11 2001Nov 15 2001

Other

Other14th Annual Meeting of the IEEE Lasers and Electro-Optics Society
CountryUnited States
CitySan Diego, CA
Period11/11/0111/15/01

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ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Fokken, G., Daniel, E., Degerstrom, M., Schaefer, T., Zabinski, P., & Gilbert, B. K. (2001). Electronic packaging for 10-100 Gb/s OE systems. In Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS (Vol. 2, pp. 861-862)