Electronic packaging for 10-100 Gb/s OE systems

G. Fokken, E. Daniel, M. Degerstrom, T. Schaefer, P. Zabinski, B. Gilbert

Research output: Contribution to journalConference article

Abstract

Electronic packaging for 10-100 Gb/s optoelectronic (OE) circuits was discussed. Signal integrity and power/ground delivery issues crucial in designing multi-GHz packaging to prevent system failure were addressed. The minimization of discontinuities in controlled-impedance signal interconnect and extention of present packaging fabrication and assembly technology to higher frequency operation were also analyzed.

Original languageEnglish (US)
Pages (from-to)861-862
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
Volume2
StatePublished - Dec 1 2001
Event14th Annual Meeting of the IEEE Lasers and Electro-Optics Society - San Diego, CA, United States
Duration: Nov 11 2001Nov 15 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Electronic packaging for 10-100 Gb/s OE systems'. Together they form a unique fingerprint.

Cite this