A chips-first multichip module implementation of passive and active test coupons utilizing Texas instruments' high density interconnect technology

Timothy M. Schaefer, Jeffrey J. Kacines, Barbara A. Randall, Lynn E. Roszel, Gregg J. Fokken, David Walter, Daniel J. Schwab, Larry Mowatt, Barry K. Gilbert

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

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Engineering & Materials Science