The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

Daniel J. Schwab, Barbara Randall, Patrick J. Zabinski, Timothy M. Schaefer, Barry K. Gilbert

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Fingerprint

Dive into the research topics of 'The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits'. Together they form a unique fingerprint.

Engineering & Materials Science