Abstract
An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X hand (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested.
Original language | English (US) |
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Pages (from-to) | 79-91 |
Number of pages | 13 |
Journal | IEEE Transactions on Advanced Packaging |
Volume | 25 |
Issue number | 1 |
DOIs | |
State | Published - Feb 2002 |
Keywords
- Digital receiver
- MCM-L
- S-parameter measurements
- Transmission lines
- Wire bonds
ASJC Scopus subject areas
- Electrical and Electronic Engineering