The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

Daniel J. Schwab, Barbara Randall, Patrick J. Zabinski, Timothy M. Schaefer, Barry Kent Gilbert

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

An investigation of the high-frequency performance of laminate multichip module (MCM-L) technology was undertaken with the goal of demonstrating its appropriateness for the development of digital radar receivers operating in the X hand (8 to 12 GHz). A seven-chip circuit using digital components on a Gore MCM-L was successfully tested up to 9.6 GHz. An analog-to-digital converter on an MCM-L was successfully tested up to 6 GHz. An extensive characterization of the MCM-L technology using both simulations and measurements was performed to formulate a set of design guidelines for high-frequency applications. A novel dielectric-encapsulated MCM-to-MCM interconnect scheme was proposed and tested.

Original languageEnglish (US)
Pages (from-to)79-91
Number of pages13
JournalIEEE Transactions on Advanced Packaging
Volume25
Issue number1
DOIs
StatePublished - Feb 2002

Fingerprint

Multichip modules
Laminates
Packaging
Networks (circuits)
Multicarrier modulation
Radar receivers
Digital circuits
Digital to analog conversion

Keywords

  • Digital receiver
  • MCM-L
  • S-parameter measurements
  • Transmission lines
  • Wire bonds

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits. / Schwab, Daniel J.; Randall, Barbara; Zabinski, Patrick J.; Schaefer, Timothy M.; Gilbert, Barry Kent.

In: IEEE Transactions on Advanced Packaging, Vol. 25, No. 1, 02.2002, p. 79-91.

Research output: Contribution to journalArticle

Schwab, Daniel J. ; Randall, Barbara ; Zabinski, Patrick J. ; Schaefer, Timothy M. ; Gilbert, Barry Kent. / The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits. In: IEEE Transactions on Advanced Packaging. 2002 ; Vol. 25, No. 1. pp. 79-91.
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