The manufacturing of an electroplated Ni layer on textured Cu substrate for Cu-based HTS coated conductors

Y. X. Zhou, L. Sun, X. Chen, H. Fang, P. T. Putman, K. Salama

Research output: Contribution to journalArticle

22 Scopus citations

Abstract

A sharp cube textured Ni overlayer on Cu substrates has been developed for the manufacturing of long-length RABiTS-based coated conductor tapes. Using a low-cost, non-vacuum and easily scalable technique of electroplating, smooth, crack-free and continuous Ni overlayers were deposited on cube textured Cu substrates without any intermediate layers. In addition, sharp cube textured Sm-doped CeO2 buffer layers have been grown on the Ni-plated Cu substrates using pulsed laser deposition and found to exhibit in-plane and out-of-plane FWHM values of 6.50° and 5.25°, respectively. This electroplating process promises an efficient route for manufacturing Cu-based HTS coated conductors.

Original languageEnglish (US)
Pages (from-to)107-111
Number of pages5
JournalSuperconductor Science and Technology
Volume18
Issue number1
DOIs
StatePublished - Jan 1 2005

ASJC Scopus subject areas

  • Ceramics and Composites
  • Condensed Matter Physics
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry

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