System design and packaging for an optically interconnected MCM switch for parallel computing

Jeremy Ekman, Fouad Kiamilev, Gregg Fokken, Mark Vickberg, Ping Gui, Michael Haney, Kevin Driscoll, Scott Sommerfeldt, Yue Liu, Premanand Chandramani, Marc Christensen, Barry Kent Gilbert, Allen Cox, Xiaoqing Wang, Predrag Milojkovic, Brian Vanvoorst

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Smart Pixel Arrays (SPAs) integrate two-dimensional arrays of optoelectronic devices (VCSELs and photodetectors) with state-of-the-art silicon VLSI circuits. This technology has the potential to improve the speed and density of computing and switching systems while reducing their size and power consumption. We describe a gigabit switch that integrates multiple SPAs onto an MCM and interconnects them using free-space optical interconnects. Parallel fiber optic data links are used to interface the switch to each compute node in a workstation cluster. The interdependence between electronic packaging, optical design, system architecture and circuit design is discussed.

Original languageEnglish (US)
Title of host publicationAdvances in Electronic Packaging
Pages1643-1650
Number of pages8
Volume3
StatePublished - 2001
EventAdvances in Electronic Packaging - Kauai, Hi, United States
Duration: Jul 8 2001Jul 13 2001

Other

OtherAdvances in Electronic Packaging
CountryUnited States
CityKauai, Hi
Period7/8/017/13/01

Fingerprint

Multicarrier modulation
Parallel processing systems
Packaging
Pixels
Systems analysis
Switches
Electronics packaging
Optical design
Optical interconnects
Switching systems
VLSI circuits
Surface emitting lasers
Photodetectors
Optoelectronic devices
Fiber optics
Electric power utilization
Silicon
Networks (circuits)

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

Cite this

Ekman, J., Kiamilev, F., Fokken, G., Vickberg, M., Gui, P., Haney, M., ... Vanvoorst, B. (2001). System design and packaging for an optically interconnected MCM switch for parallel computing. In Advances in Electronic Packaging (Vol. 3, pp. 1643-1650)

System design and packaging for an optically interconnected MCM switch for parallel computing. / Ekman, Jeremy; Kiamilev, Fouad; Fokken, Gregg; Vickberg, Mark; Gui, Ping; Haney, Michael; Driscoll, Kevin; Sommerfeldt, Scott; Liu, Yue; Chandramani, Premanand; Christensen, Marc; Gilbert, Barry Kent; Cox, Allen; Wang, Xiaoqing; Milojkovic, Predrag; Vanvoorst, Brian.

Advances in Electronic Packaging. Vol. 3 2001. p. 1643-1650.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ekman, J, Kiamilev, F, Fokken, G, Vickberg, M, Gui, P, Haney, M, Driscoll, K, Sommerfeldt, S, Liu, Y, Chandramani, P, Christensen, M, Gilbert, BK, Cox, A, Wang, X, Milojkovic, P & Vanvoorst, B 2001, System design and packaging for an optically interconnected MCM switch for parallel computing. in Advances in Electronic Packaging. vol. 3, pp. 1643-1650, Advances in Electronic Packaging, Kauai, Hi, United States, 7/8/01.
Ekman J, Kiamilev F, Fokken G, Vickberg M, Gui P, Haney M et al. System design and packaging for an optically interconnected MCM switch for parallel computing. In Advances in Electronic Packaging. Vol. 3. 2001. p. 1643-1650
Ekman, Jeremy ; Kiamilev, Fouad ; Fokken, Gregg ; Vickberg, Mark ; Gui, Ping ; Haney, Michael ; Driscoll, Kevin ; Sommerfeldt, Scott ; Liu, Yue ; Chandramani, Premanand ; Christensen, Marc ; Gilbert, Barry Kent ; Cox, Allen ; Wang, Xiaoqing ; Milojkovic, Predrag ; Vanvoorst, Brian. / System design and packaging for an optically interconnected MCM switch for parallel computing. Advances in Electronic Packaging. Vol. 3 2001. pp. 1643-1650
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