TY - GEN
T1 - Stereomask lithography for multi-object bio-patterning
AU - Zhao, Siwei
AU - Chen, Arnold
AU - Revzin, Alexander
AU - Pan, Tingrui
PY - 2011/4/13
Y1 - 2011/4/13
N2 - The advent of biological micro-patterning techniques has given new impetus to many areas of biological research, including quantitative biochemical analysis, biosensing, and regenerative medicine. Conventional micropatterning techniques (e.g. photolithography and soft lithography) although have seen encouraging adaptation to biological applications, still have not completely addressed the needs of constructing multi-object biological microarrays with single cell resolution without requiring cleanroom access. In this abstract, we present a novel versatile biological lithography technique to achieve integrated multi-object patterning with high resolution and high adaptability to various biomaterials, referred to as the Stereomask Lithography (SML). It is based on serial placement of multiple biological objects using a novel three dimensional shadow mask with protection for previously patterned materials and a peg-in-hole interlayer alignment scheme.
AB - The advent of biological micro-patterning techniques has given new impetus to many areas of biological research, including quantitative biochemical analysis, biosensing, and regenerative medicine. Conventional micropatterning techniques (e.g. photolithography and soft lithography) although have seen encouraging adaptation to biological applications, still have not completely addressed the needs of constructing multi-object biological microarrays with single cell resolution without requiring cleanroom access. In this abstract, we present a novel versatile biological lithography technique to achieve integrated multi-object patterning with high resolution and high adaptability to various biomaterials, referred to as the Stereomask Lithography (SML). It is based on serial placement of multiple biological objects using a novel three dimensional shadow mask with protection for previously patterned materials and a peg-in-hole interlayer alignment scheme.
UR - http://www.scopus.com/inward/record.url?scp=79953795966&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79953795966&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2011.5734430
DO - 10.1109/MEMSYS.2011.5734430
M3 - Conference contribution
AN - SCOPUS:79953795966
SN - 9781424496327
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 336
EP - 339
BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Y2 - 23 January 2011 through 27 January 2011
ER -