Singular value decomposition-based noise equalization for ultrafast plane wave microvessel imaging

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrafast plane wave microvessel imaging significantly improves ultrasound Doppler sensitivity. The rich spatiotemporal plane wave data enables robust clutter filtering based on singular value decomposition (SVD). However, due to the lack of transmit focusing, plane wave microvessel imaging is very susceptible to noise. The mid-to-deep region of the microvessel image is typically saturated by noise, hampering the visibility of microvessels. This study was designed to: 1) study the fundamental relationship between ultrasound system noise and microvessel signal; 2) propose an adaptive and computationally cost-effective noise equalization method derived from the SVD clutter filtering process to improve microvessel image quality.

Original languageEnglish (US)
Title of host publication2017 IEEE International Ultrasonics Symposium, IUS 2017
PublisherIEEE Computer Society
ISBN (Electronic)9781538633830
DOIs
StatePublished - Oct 31 2017
Event2017 IEEE International Ultrasonics Symposium, IUS 2017 - Washington, United States
Duration: Sep 6 2017Sep 9 2017

Other

Other2017 IEEE International Ultrasonics Symposium, IUS 2017
CountryUnited States
CityWashington
Period9/6/179/9/17

Fingerprint

plane waves
decomposition
clutter
visibility
costs
sensitivity

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

Cite this

Singular value decomposition-based noise equalization for ultrafast plane wave microvessel imaging. / Song, Pengfei; Manduca, Armando; Trazasko, Joshua D; Chen, Shigao D.

2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 2017. 8091722.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Song, P, Manduca, A, Trazasko, JD & Chen, SD 2017, Singular value decomposition-based noise equalization for ultrafast plane wave microvessel imaging. in 2017 IEEE International Ultrasonics Symposium, IUS 2017., 8091722, IEEE Computer Society, 2017 IEEE International Ultrasonics Symposium, IUS 2017, Washington, United States, 9/6/17. https://doi.org/10.1109/ULTSYM.2017.8091722
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