Signal integrity evaluation of a 10 Gbits/sec optoelectronic interconnect

Mark Kahrs, Steven P. Levitan, Donald M. Chiarulli, Timothy P. Kurzweg, José A. Martínez, Jason Boles, Abijhit J. Davare, Ethan Jackson, Craig Windish, Fouad Kiamilev, Amit Bhaduri, Muhammad Taufik, Xingle Wang, Arthur S. Morris, Joseph Repke, James Kruchowski, Barry K. Gilbert

Research output: Contribution to journalConference article

Abstract

Signal integrity is of vital importance to high speed interconnects. The 10G system is a 10 Gbit/second optical interconnect with a cross-section bandwidth of over 1T bit/second fabricated on a heterogeneous platform consisting of a multi-chip module, high-speed SiGe and GaAs opto-electronics. We compare lumped and multisegment microstrip models of the transmission lines on the MCM hybrid. We also modeled the wirebonds using a Quasi-Static model and a Co-Planar Waveguide (CPW) model for the bump bonds between the GaAs and SiGe substrates. These models are utilized by a behavioral simulator to demonstrate the effects of interconnect components on waveform shape. The results demonstrate convincingly that signal integrity is of critical importance to end-to-end performance measures at high transmission speeds and that incorporating these models is important to behavioral simulation.

Original languageEnglish (US)
Pages (from-to)1211-1214
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume2
StatePublished - Aug 18 2003
Event2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States
Duration: Jun 8 2003Jun 13 2003

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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