Power Delivery Network Pre-Layout Design Planning and Analysis through Automated Scripting

Chad M. Smutzer, Christopher K. White, Clifton R Haider, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Passive power delivery design has often been an afterthought in printed circuit board (PCB) and package design processes. Signal performance is frequently prioritized using the most optimal resources available to the design engineers. Based upon recent experience, the power delivery network (PDN) requirements for high performance compute (HPC) systems have evolved to a level of stringency that must be addressed through rigorous and purposeful design practice rivaling traditional high-speed signaling considerations. A pre-layout design planning process, using automated structure and parameter scripting, with corresponding AC and DC analyses in relevant power delivery networks, is presented here.

Original languageEnglish (US)
Title of host publication2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538683422
DOIs
StatePublished - Jun 1 2019
Event23rd IEEE Workshop on Signal and Power Integrity, SPI 2019 - Chambery, France
Duration: Jun 18 2019Jun 21 2019

Publication series

Name2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings

Conference

Conference23rd IEEE Workshop on Signal and Power Integrity, SPI 2019
CountryFrance
CityChambery
Period6/18/196/21/19

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Electrical and Electronic Engineering
  • Instrumentation

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  • Cite this

    Smutzer, C. M., White, C. K., Haider, C. R., & Gilbert, B. K. (2019). Power Delivery Network Pre-Layout Design Planning and Analysis through Automated Scripting. In 2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings [8781657] (2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SaPIW.2019.8781657