TY - GEN
T1 - Power Delivery Network Pre-Layout Design Planning and Analysis through Automated Scripting
AU - Smutzer, Chad M.
AU - White, Christopher K.
AU - Haider, Clifton R
AU - Gilbert, Barry Kent
PY - 2019/6/1
Y1 - 2019/6/1
N2 - Passive power delivery design has often been an afterthought in printed circuit board (PCB) and package design processes. Signal performance is frequently prioritized using the most optimal resources available to the design engineers. Based upon recent experience, the power delivery network (PDN) requirements for high performance compute (HPC) systems have evolved to a level of stringency that must be addressed through rigorous and purposeful design practice rivaling traditional high-speed signaling considerations. A pre-layout design planning process, using automated structure and parameter scripting, with corresponding AC and DC analyses in relevant power delivery networks, is presented here.
AB - Passive power delivery design has often been an afterthought in printed circuit board (PCB) and package design processes. Signal performance is frequently prioritized using the most optimal resources available to the design engineers. Based upon recent experience, the power delivery network (PDN) requirements for high performance compute (HPC) systems have evolved to a level of stringency that must be addressed through rigorous and purposeful design practice rivaling traditional high-speed signaling considerations. A pre-layout design planning process, using automated structure and parameter scripting, with corresponding AC and DC analyses in relevant power delivery networks, is presented here.
UR - http://www.scopus.com/inward/record.url?scp=85070889572&partnerID=8YFLogxK
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U2 - 10.1109/SaPIW.2019.8781657
DO - 10.1109/SaPIW.2019.8781657
M3 - Conference contribution
T3 - 2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
BT - 2019 IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd IEEE Workshop on Signal and Power Integrity, SPI 2019
Y2 - 18 June 2019 through 21 June 2019
ER -