Performance of TI high density interconnect for 1 GHz digital MCM applications

Jeffery J. Kacines, Tim M. Schaefer, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Multichip modules have inherent performance advantages over other packaging technologies to which digital designers are turning to meet stringent system performance requirements. However, for designs requiring up to 1 GHz clocks and subnanosecond rise times, a thorough understanding of the multichip module interconnect is essential to fully utilize performance advantages. At these operating speeds, interconnect as short as one inch can limit system performance in a poorly designed module. This paper presents preliminary data from a joint effort between Texas Instruments (TI) and the Mayo Foundation under sponsorship of the Advanced Research Projects Agency (ARPA) which is characterizing the HDI process for use in high speed designs. Results indicate that HDI technology is well suited for use in digital designs that have clock frequencies as high as one gigahertz and subnanosecond rise times with acceptable noise and signal degradation.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages669-673
Number of pages5
StatePublished - 1995
Externally publishedYes
EventProceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA
Duration: May 21 1995May 24 1995

Other

OtherProceedings of the 1995 45th Electronic Components & Technology Conference
CityLas Vegas, NV, USA
Period5/21/955/24/95

Fingerprint

Multicarrier modulation
Multichip modules
Clocks
Packaging
Degradation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kacines, J. J., Schaefer, T. M., & Gilbert, B. K. (1995). Performance of TI high density interconnect for 1 GHz digital MCM applications. In Proceedings - Electronic Components and Technology Conference (pp. 669-673). IEEE.

Performance of TI high density interconnect for 1 GHz digital MCM applications. / Kacines, Jeffery J.; Schaefer, Tim M.; Gilbert, Barry Kent.

Proceedings - Electronic Components and Technology Conference. IEEE, 1995. p. 669-673.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kacines, JJ, Schaefer, TM & Gilbert, BK 1995, Performance of TI high density interconnect for 1 GHz digital MCM applications. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 669-673, Proceedings of the 1995 45th Electronic Components & Technology Conference, Las Vegas, NV, USA, 5/21/95.
Kacines JJ, Schaefer TM, Gilbert BK. Performance of TI high density interconnect for 1 GHz digital MCM applications. In Proceedings - Electronic Components and Technology Conference. IEEE. 1995. p. 669-673
Kacines, Jeffery J. ; Schaefer, Tim M. ; Gilbert, Barry Kent. / Performance of TI high density interconnect for 1 GHz digital MCM applications. Proceedings - Electronic Components and Technology Conference. IEEE, 1995. pp. 669-673
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