Performance of low loss, high speed interconnects for multi-GHz digital systems

K. Jayaraj, T. J. Moravec, R. L. Thompson, D. J. Schwab, B. K. Gilbert

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

Preliminary frequency-, time-, and digital-domain testing and electromagnetic simulations indicate that the striplines and microstrip lines of Honeywell's thin-film multilayer (TFML) technology are suitable for high-performance digital systems that require operation at frequencies greater than 1 GHz. The return loss was typically -20 dB, which indicates the ability to design and fabricate controlled impedance lines with Honeywells' TFML technology. The 1- and 2-GHz digital-domain test measurements did not appear to be affected significantly by the reflections. The insertion loss of approximately -2.5 dB/in. at 9 GHz is acceptable for relatively short signal interconnect lines which, in any event, are required to minimize interchip propagation delays in a functioning system. Predictions from the Mayo electromagnetic modeling package show excellent agreement with measured signal and crosstalk waveforms. The crosstalk between adjacent lines is less than -20 dB even when the coupled line length is very long (>6 in.). Vias and via pads show negligible effects on insertion and return losses up to a frequency of 9 GHz. Large impedance mismatches severely affect the return losses, and therefore should be avoided. Stubs in the interconnect must be kept smaller than 1/4 of the smallest wavelength within the signal bandwidth.

Original languageEnglish (US)
Pages1674-1681
Number of pages8
StatePublished - Dec 1 1989
EventProceedings of the IEEE 1989 National Aerospace and Electronics Conference - NAECON 1989 - Dayton, OH, USA
Duration: May 22 1989May 26 1989

Other

OtherProceedings of the IEEE 1989 National Aerospace and Electronics Conference - NAECON 1989
CityDayton, OH, USA
Period5/22/895/26/89

ASJC Scopus subject areas

  • Engineering(all)

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