Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel; Vladimir Sokolov; Scott Sommerfeldt; James Bublitz; Kimberly Olson; Barry Gilbert; Lorene Samoska; David Chow

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel, Vladimir Sokolov, Scott Sommerfeldt, James Bublitz, Kimberly Olson, Barry Gilbert, Lorene Samoska, David Chow

Physiology & Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Scopus citations

Abstract

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

Original language	English (US)
Title of host publication	Proceedings IEEE Lester Eastman Conference on High Performance Devices
Pages	374-383
Number of pages	10
State	Published - 2002
Event	Proceedings IEEE Lester Eastman Conference on High Performance Devices - Newark, DE, United States Duration: Aug 6 2002 → Aug 8 2002

Publication series

Name	Proceedings IEEE Lester Eastman Conference on High Performance Devices

Other

Other	Proceedings IEEE Lester Eastman Conference on High Performance Devices
Country/Territory	United States
City	Newark, DE
Period	8/6/02 → 8/8/02

ASJC Scopus subject areas

General Engineering

Cite this

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. / Daniel, Erik; Sokolov, Vladimir; Sommerfeldt, Scott et al.
Proceedings IEEE Lester Eastman Conference on High Performance Devices. 2002. p. 374-383 (Proceedings IEEE Lester Eastman Conference on High Performance Devices).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Daniel, E, Sokolov, V, Sommerfeldt, S, Bublitz, J, Olson, K, Gilbert, B, Samoska, L & Chow, D 2002, Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. in Proceedings IEEE Lester Eastman Conference on High Performance Devices. Proceedings IEEE Lester Eastman Conference on High Performance Devices, pp. 374-383, Proceedings IEEE Lester Eastman Conference on High Performance Devices, Newark, DE, United States, 8/6/02.

@inproceedings{11d08519a38c45ada3f5ed9257929d89,

title = "Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz",

abstract = "Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.",

author = "Erik Daniel and Vladimir Sokolov and Scott Sommerfeldt and James Bublitz and Kimberly Olson and Barry Gilbert and Lorene Samoska and David Chow",

year = "2002",

language = "English (US)",

isbn = "0780374789",

series = "Proceedings IEEE Lester Eastman Conference on High Performance Devices",

pages = "374--383",

booktitle = "Proceedings IEEE Lester Eastman Conference on High Performance Devices",

note = "Proceedings IEEE Lester Eastman Conference on High Performance Devices ; Conference date: 06-08-2002 Through 08-08-2002",

}

TY - GEN

T1 - Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

AU - Daniel, Erik

AU - Sokolov, Vladimir

AU - Sommerfeldt, Scott

AU - Bublitz, James

AU - Olson, Kimberly

AU - Gilbert, Barry

AU - Samoska, Lorene

AU - Chow, David

PY - 2002

Y1 - 2002

N2 - Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

AB - Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

UR - http://www.scopus.com/inward/record.url?scp=0242365516&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0242365516&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0242365516

SN - 0780374789

T3 - Proceedings IEEE Lester Eastman Conference on High Performance Devices

SP - 374

EP - 383

BT - Proceedings IEEE Lester Eastman Conference on High Performance Devices

T2 - Proceedings IEEE Lester Eastman Conference on High Performance Devices

Y2 - 6 August 2002 through 8 August 2002

ER -

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Abstract

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Other

ASJC Scopus subject areas

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