Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel, Vladimir Sokolov, Scott Sommerfeldt, James Bublitz, Kimberly Olson, Barry Gilbert, Lorene Samoska, David Chow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

Original languageEnglish (US)
Title of host publicationProceedings IEEE Lester Eastman Conference on High Performance Devices
Pages374-383
Number of pages10
StatePublished - Dec 1 2002
EventProceedings IEEE Lester Eastman Conference on High Performance Devices - Newark, DE, United States
Duration: Aug 6 2002Aug 8 2002

Publication series

NameProceedings IEEE Lester Eastman Conference on High Performance Devices

Other

OtherProceedings IEEE Lester Eastman Conference on High Performance Devices
CountryUnited States
CityNewark, DE
Period8/6/028/8/02

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz'. Together they form a unique fingerprint.

  • Cite this

    Daniel, E., Sokolov, V., Sommerfeldt, S., Bublitz, J., Olson, K., Gilbert, B., Samoska, L., & Chow, D. (2002). Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. In Proceedings IEEE Lester Eastman Conference on High Performance Devices (pp. 374-383). (Proceedings IEEE Lester Eastman Conference on High Performance Devices).