Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel, Vladimir Sokolov, Scott Sommerfeldt, James Bublitz, Kimberly Olson, Barry Kent Gilbert, Lorene Samoska, David Chow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

Original languageEnglish (US)
Title of host publicationProceedings IEEE Lester Eastman Conference on High Performance Devices
Pages374-383
Number of pages10
StatePublished - 2002
EventProceedings IEEE Lester Eastman Conference on High Performance Devices - Newark, DE, United States
Duration: Aug 6 2002Aug 8 2002

Other

OtherProceedings IEEE Lester Eastman Conference on High Performance Devices
CountryUnited States
CityNewark, DE
Period8/6/028/8/02

Fingerprint

Microwave integrated circuits
Monolithic microwave integrated circuits
Packaging
Waveguides
High electron mobility transistors
Insertion losses

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Daniel, E., Sokolov, V., Sommerfeldt, S., Bublitz, J., Olson, K., Gilbert, B. K., ... Chow, D. (2002). Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. In Proceedings IEEE Lester Eastman Conference on High Performance Devices (pp. 374-383)

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. / Daniel, Erik; Sokolov, Vladimir; Sommerfeldt, Scott; Bublitz, James; Olson, Kimberly; Gilbert, Barry Kent; Samoska, Lorene; Chow, David.

Proceedings IEEE Lester Eastman Conference on High Performance Devices. 2002. p. 374-383.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Daniel, E, Sokolov, V, Sommerfeldt, S, Bublitz, J, Olson, K, Gilbert, BK, Samoska, L & Chow, D 2002, Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. in Proceedings IEEE Lester Eastman Conference on High Performance Devices. pp. 374-383, Proceedings IEEE Lester Eastman Conference on High Performance Devices, Newark, DE, United States, 8/6/02.
Daniel E, Sokolov V, Sommerfeldt S, Bublitz J, Olson K, Gilbert BK et al. Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. In Proceedings IEEE Lester Eastman Conference on High Performance Devices. 2002. p. 374-383
Daniel, Erik ; Sokolov, Vladimir ; Sommerfeldt, Scott ; Bublitz, James ; Olson, Kimberly ; Gilbert, Barry Kent ; Samoska, Lorene ; Chow, David. / Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. Proceedings IEEE Lester Eastman Conference on High Performance Devices. 2002. pp. 374-383
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