Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel; Vladimir Sokolov; Scott Sommerfeldt; James Bublitz; Kimberly Olson; Barry Gilbert; Lorene Samoska; David Chow

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Erik Daniel, Vladimir Sokolov, Scott Sommerfeldt, James Bublitz, Kimberly Olson, Barry Gilbert, Lorene Samoska, David Chow

Physiology & Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Scopus citations

Abstract

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

Original language	English (US)
Title of host publication	Proceedings IEEE Lester Eastman Conference on High Performance Devices
Pages	374-383
Number of pages	10
State	Published - Dec 1 2002
Event	Proceedings IEEE Lester Eastman Conference on High Performance Devices - Newark, DE, United States Duration: Aug 6 2002 → Aug 8 2002

Publication series

Name	Proceedings IEEE Lester Eastman Conference on High Performance Devices

Other

Other	Proceedings IEEE Lester Eastman Conference on High Performance Devices
Country/Territory	United States
City	Newark, DE
Period	8/6/02 → 8/8/02

ASJC Scopus subject areas

Engineering(all)

Cite this

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. / Daniel, Erik; Sokolov, Vladimir; Sommerfeldt, Scott et al.
Proceedings IEEE Lester Eastman Conference on High Performance Devices. 2002. p. 374-383 (Proceedings IEEE Lester Eastman Conference on High Performance Devices).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Daniel, E, Sokolov, V, Sommerfeldt, S, Bublitz, J, Olson, K, Gilbert, B, Samoska, L & Chow, D 2002, Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz. in Proceedings IEEE Lester Eastman Conference on High Performance Devices. Proceedings IEEE Lester Eastman Conference on High Performance Devices, pp. 374-383, Proceedings IEEE Lester Eastman Conference on High Performance Devices, Newark, DE, United States, 8/6/02.

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abstract = "Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.",

author = "Erik Daniel and Vladimir Sokolov and Scott Sommerfeldt and James Bublitz and Kimberly Olson and Barry Gilbert and Lorene Samoska and David Chow",

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AU - Daniel, Erik

AU - Sokolov, Vladimir

AU - Sommerfeldt, Scott

AU - Bublitz, James

AU - Olson, Kimberly

AU - Gilbert, Barry

AU - Samoska, Lorene

AU - Chow, David

PY - 2002/12/1

Y1 - 2002/12/1

N2 - Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

AB - Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB from DC to 110 GHz. A motherboard / daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.

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M3 - Conference contribution

AN - SCOPUS:0242365516

SN - 0780374789

T3 - Proceedings IEEE Lester Eastman Conference on High Performance Devices

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BT - Proceedings IEEE Lester Eastman Conference on High Performance Devices

T2 - Proceedings IEEE Lester Eastman Conference on High Performance Devices

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ER -

Packaging of Microwave Integrated Circuits Operating Beyond 100 GHz

Abstract

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Other

ASJC Scopus subject areas

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