Abstract
Past and present developments in GaAs integrated circuits are considered. Future aspects of their applications are pointed out. Topics reviewed include: signal processing, logic and arithmetic, global architectural approaches, pipelining, reliability, packaging, interconnect technology, chip encapsulation, dual in-line packages, ceramic chip carriers, and packaging parasitics.
| Original language | English (US) |
|---|---|
| Title of host publication | VLSI Electronics, Microstructure Science |
| Publisher | Academic Press Inc |
| Pages | 289-331 |
| Number of pages | 43 |
| Volume | 11 |
| ISBN (Print) | 0122341112 |
| State | Published - Jan 1 1985 |
ASJC Scopus subject areas
- Engineering(all)