PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS.

Research output: Book/ReportBook

4 Citations (Scopus)

Abstract

Past and present developments in GaAs integrated circuits are considered. Future aspects of their applications are pointed out. Topics reviewed include: signal processing, logic and arithmetic, global architectural approaches, pipelining, reliability, packaging, interconnect technology, chip encapsulation, dual in-line packages, ceramic chip carriers, and packaging parasitics.

Original languageEnglish (US)
Place of PublicationOrlando, FL, USA
PublisherAcademic Press Inc
Number of pages43
ISBN (Print)0122341112
StatePublished - 1985

Fingerprint

Packaging
Encapsulation
Integrated circuits
Signal processing

ASJC Scopus subject areas

  • Engineering(all)

Cite this

PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS. / Gilbert, Barry Kent.

Orlando, FL, USA : Academic Press Inc, 1985. 43 p.

Research output: Book/ReportBook

Gilbert BK. PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS. Orlando, FL, USA: Academic Press Inc, 1985. 43 p.
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