PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS.

Research output: Chapter in Book/Report/Conference proceedingChapter

4 Scopus citations

Abstract

Past and present developments in GaAs integrated circuits are considered. Future aspects of their applications are pointed out. Topics reviewed include: signal processing, logic and arithmetic, global architectural approaches, pipelining, reliability, packaging, interconnect technology, chip encapsulation, dual in-line packages, ceramic chip carriers, and packaging parasitics.

Original languageEnglish (US)
Title of host publicationVLSI Electronics, Microstructure Science
PublisherAcademic Press Inc
Pages289-331
Number of pages43
Volume11
ISBN (Print)0122341112
StatePublished - Jan 1 1985

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS.'. Together they form a unique fingerprint.

  • Cite this

    Gilbert, B. K. (1985). PACKAGING AND INTERCONNECTION OF GaAs DIGITAL INTEGRATED CIRCUITS. In VLSI Electronics, Microstructure Science (Vol. 11, pp. 289-331). Academic Press Inc.