Past and present developments in GaAs integrated circuits are considered. Future aspects of their applications are pointed out. Topics reviewed include: signal processing, logic and arithmetic, global architectural approaches, pipelining, reliability, packaging, interconnect technology, chip encapsulation, dual in-line packages, ceramic chip carriers, and packaging parasitics.
|Original language||English (US)|
|Title of host publication||VLSI Electronics, Microstructure Science|
|Publisher||Academic Press Inc|
|Number of pages||43|
|State||Published - Jan 1 1985|
ASJC Scopus subject areas