On the study of skin-effect and dispersion of heavily lossy transmission lines

G. Pan, X. Zhu, B. Wang, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist's equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous.

Original languageEnglish (US)
Title of host publicationProceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages60-63
Number of pages4
ISBN (Electronic)0818627255, 9780818627255
DOIs
StatePublished - Jan 1 1992
Event1992 IEEE Multi-Chip Module Conference, MCMC 1992 - Santa Cruz, United States
Duration: Mar 18 1992Mar 20 1992

Publication series

NameProceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

Conference

Conference1992 IEEE Multi-Chip Module Conference, MCMC 1992
CountryUnited States
CitySanta Cruz
Period3/18/923/20/92

Fingerprint

Skin effect
Microelectronics
Electric lines
Packaging
Coaxial cables
Networks (circuits)
Microwaves
Geometry

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Pan, G., Zhu, X., Wang, B., & Gilbert, B. K. (1992). On the study of skin-effect and dispersion of heavily lossy transmission lines. In Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 (pp. 60-63). [201447] (Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MCMC.1992.201447

On the study of skin-effect and dispersion of heavily lossy transmission lines. / Pan, G.; Zhu, X.; Wang, B.; Gilbert, Barry Kent.

Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92. Institute of Electrical and Electronics Engineers Inc., 1992. p. 60-63 201447 (Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pan, G, Zhu, X, Wang, B & Gilbert, BK 1992, On the study of skin-effect and dispersion of heavily lossy transmission lines. in Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92., 201447, Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92, Institute of Electrical and Electronics Engineers Inc., pp. 60-63, 1992 IEEE Multi-Chip Module Conference, MCMC 1992, Santa Cruz, United States, 3/18/92. https://doi.org/10.1109/MCMC.1992.201447
Pan G, Zhu X, Wang B, Gilbert BK. On the study of skin-effect and dispersion of heavily lossy transmission lines. In Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92. Institute of Electrical and Electronics Engineers Inc. 1992. p. 60-63. 201447. (Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92). https://doi.org/10.1109/MCMC.1992.201447
Pan, G. ; Zhu, X. ; Wang, B. ; Gilbert, Barry Kent. / On the study of skin-effect and dispersion of heavily lossy transmission lines. Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92. Institute of Electrical and Electronics Engineers Inc., 1992. pp. 60-63 (Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92).
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