Novel MCM structure for high performance digital and mixed signal applications

Christopher D. Cotton, Dennis R. Kling, Michael E. Yeomans, Timothy M. Schaefer, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Increasing demand for high data rate signal processing and modulator/demodulator functionality has driven clock rates into the gigahertz realm and increased the requirements for low loss high bandwidth interconnect structures and low noise power distribution. This paper addresses the packaging requirements for high performance digital receiver modules operating at multi-gigahertz clock speeds and discusses a novel MCM structure targeted at achieving the performance requirements. In addition, the design and electrical characterization of a passive test coupon for evaluation of the novel MCM structure will be discussed.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages114-119
Number of pages6
Volume3830
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA
Duration: Apr 6 1999Apr 9 1999

Other

OtherProceedings of the 1999 International Conference on High Density Packaging and MCMs
CityDenver, CO, USA
Period4/6/994/9/99

Fingerprint

Multicarrier modulation
Clocks
Receivers (containers)
requirements
clocks
Demodulators
Modulators
modems
Packaging
Signal processing
Bandwidth
packaging
low noise
signal processing
receivers
modules
bandwidth
evaluation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Cotton, C. D., Kling, D. R., Yeomans, M. E., Schaefer, T. M., & Gilbert, B. K. (1999). Novel MCM structure for high performance digital and mixed signal applications. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3830, pp. 114-119). Society of Photo-Optical Instrumentation Engineers.

Novel MCM structure for high performance digital and mixed signal applications. / Cotton, Christopher D.; Kling, Dennis R.; Yeomans, Michael E.; Schaefer, Timothy M.; Gilbert, Barry Kent.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3830 Society of Photo-Optical Instrumentation Engineers, 1999. p. 114-119.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cotton, CD, Kling, DR, Yeomans, ME, Schaefer, TM & Gilbert, BK 1999, Novel MCM structure for high performance digital and mixed signal applications. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 3830, Society of Photo-Optical Instrumentation Engineers, pp. 114-119, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, Denver, CO, USA, 4/6/99.
Cotton CD, Kling DR, Yeomans ME, Schaefer TM, Gilbert BK. Novel MCM structure for high performance digital and mixed signal applications. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3830. Society of Photo-Optical Instrumentation Engineers. 1999. p. 114-119
Cotton, Christopher D. ; Kling, Dennis R. ; Yeomans, Michael E. ; Schaefer, Timothy M. ; Gilbert, Barry Kent. / Novel MCM structure for high performance digital and mixed signal applications. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3830 Society of Photo-Optical Instrumentation Engineers, 1999. pp. 114-119
@inproceedings{d4675928243d42ee94c0f03056c6fe3b,
title = "Novel MCM structure for high performance digital and mixed signal applications",
abstract = "Increasing demand for high data rate signal processing and modulator/demodulator functionality has driven clock rates into the gigahertz realm and increased the requirements for low loss high bandwidth interconnect structures and low noise power distribution. This paper addresses the packaging requirements for high performance digital receiver modules operating at multi-gigahertz clock speeds and discusses a novel MCM structure targeted at achieving the performance requirements. In addition, the design and electrical characterization of a passive test coupon for evaluation of the novel MCM structure will be discussed.",
author = "Cotton, {Christopher D.} and Kling, {Dennis R.} and Yeomans, {Michael E.} and Schaefer, {Timothy M.} and Gilbert, {Barry Kent}",
year = "1999",
language = "English (US)",
volume = "3830",
pages = "114--119",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "Society of Photo-Optical Instrumentation Engineers",

}

TY - GEN

T1 - Novel MCM structure for high performance digital and mixed signal applications

AU - Cotton, Christopher D.

AU - Kling, Dennis R.

AU - Yeomans, Michael E.

AU - Schaefer, Timothy M.

AU - Gilbert, Barry Kent

PY - 1999

Y1 - 1999

N2 - Increasing demand for high data rate signal processing and modulator/demodulator functionality has driven clock rates into the gigahertz realm and increased the requirements for low loss high bandwidth interconnect structures and low noise power distribution. This paper addresses the packaging requirements for high performance digital receiver modules operating at multi-gigahertz clock speeds and discusses a novel MCM structure targeted at achieving the performance requirements. In addition, the design and electrical characterization of a passive test coupon for evaluation of the novel MCM structure will be discussed.

AB - Increasing demand for high data rate signal processing and modulator/demodulator functionality has driven clock rates into the gigahertz realm and increased the requirements for low loss high bandwidth interconnect structures and low noise power distribution. This paper addresses the packaging requirements for high performance digital receiver modules operating at multi-gigahertz clock speeds and discusses a novel MCM structure targeted at achieving the performance requirements. In addition, the design and electrical characterization of a passive test coupon for evaluation of the novel MCM structure will be discussed.

UR - http://www.scopus.com/inward/record.url?scp=0033364136&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033364136&partnerID=8YFLogxK

M3 - Conference contribution

VL - 3830

SP - 114

EP - 119

BT - Proceedings of SPIE - The International Society for Optical Engineering

PB - Society of Photo-Optical Instrumentation Engineers

ER -