Abstract
Increasing demand for high data rate signal processing and modulator/demodulator functionality has driven clock rates into the gigahertz realm and increased the requirements for low loss high bandwidth interconnect structures and low noise power distribution. This paper addresses the packaging requirements for high performance digital receiver modules operating at multi-gigahertz clock speeds and discusses a novel MCM structure targeted at achieving the performance requirements. In addition, the design and electrical characterization of a passive test coupon for evaluation of the novel MCM structure will be discussed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 114-119 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3830 |
| State | Published - 1999 |
| Event | Proceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA Duration: Apr 6 1999 → Apr 9 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering