Multi-GHz VCSEL electrical packaging analysis

Stephen H. Hall, Wayne L. Walters, Larry F. Mattson, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingChapter

7 Citations (Scopus)

Abstract

This paper briefly discusses some of the major problems associated with multi-GHz (i.e., > 1 GBPS) VCSEL packaging. Spice simulations for the TO-56 laser can are presented and compared to measured laboratory data for model verification. Spice models were used to determine frequency limitations associated with the TO-46 and TO-56 laser cans. The lessons learned from the analysis of the TO-46 and TO-56 cans were used to design and model a conceptual VCSEL package, dubbed OPAL (Optical Package for Advanced Lasers), capable of operation to data rates as high as 4.8 GBPS. The modeling techniques used to match the TO-46 and TO-56 time domain and frequency domain simulations to measurements were extrapolated to create a model of OPAL and evaluate it at high frequencies.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages605-611
Number of pages7
StatePublished - 1996
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: May 28 1996May 31 1996

Other

OtherProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
CityOrlando, FL, USA
Period5/28/965/31/96

Fingerprint

Surface emitting lasers
Packaging
Lasers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hall, S. H., Walters, W. L., Mattson, L. F., & Gilbert, B. K. (1996). Multi-GHz VCSEL electrical packaging analysis. In Proceedings - Electronic Components and Technology Conference (pp. 605-611). IEEE.

Multi-GHz VCSEL electrical packaging analysis. / Hall, Stephen H.; Walters, Wayne L.; Mattson, Larry F.; Gilbert, Barry Kent.

Proceedings - Electronic Components and Technology Conference. IEEE, 1996. p. 605-611.

Research output: Chapter in Book/Report/Conference proceedingChapter

Hall, SH, Walters, WL, Mattson, LF & Gilbert, BK 1996, Multi-GHz VCSEL electrical packaging analysis. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 605-611, Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC, Orlando, FL, USA, 5/28/96.
Hall SH, Walters WL, Mattson LF, Gilbert BK. Multi-GHz VCSEL electrical packaging analysis. In Proceedings - Electronic Components and Technology Conference. IEEE. 1996. p. 605-611
Hall, Stephen H. ; Walters, Wayne L. ; Mattson, Larry F. ; Gilbert, Barry Kent. / Multi-GHz VCSEL electrical packaging analysis. Proceedings - Electronic Components and Technology Conference. IEEE, 1996. pp. 605-611
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