Modeling Metal Surface Roughness with a Single Parameter

Michael J. Degerstrom, Christopher K. White, Barry Kent Gilbert, Clifton R Haider

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surface roughness.

Original languageEnglish (US)
Title of host publicationEPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages249-251
Number of pages3
ISBN (Electronic)9781538693032
DOIs
StatePublished - Nov 13 2018
Event27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018 - San Jose, United States
Duration: Oct 14 2018Oct 17 2018

Other

Other27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018
CountryUnited States
CitySan Jose
Period10/14/1810/17/18

Fingerprint

Surface roughness
Metals

Keywords

  • Hexagonal close-packed spheres
  • Surface roughness
  • Transmission line

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

Cite this

Degerstrom, M. J., White, C. K., Gilbert, B. K., & Haider, C. R. (2018). Modeling Metal Surface Roughness with a Single Parameter. In EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (pp. 249-251). [8534270] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2018.8534270

Modeling Metal Surface Roughness with a Single Parameter. / Degerstrom, Michael J.; White, Christopher K.; Gilbert, Barry Kent; Haider, Clifton R.

EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. p. 249-251 8534270.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Degerstrom, MJ, White, CK, Gilbert, BK & Haider, CR 2018, Modeling Metal Surface Roughness with a Single Parameter. in EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems., 8534270, Institute of Electrical and Electronics Engineers Inc., pp. 249-251, 27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018, San Jose, United States, 10/14/18. https://doi.org/10.1109/EPEPS.2018.8534270
Degerstrom MJ, White CK, Gilbert BK, Haider CR. Modeling Metal Surface Roughness with a Single Parameter. In EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc. 2018. p. 249-251. 8534270 https://doi.org/10.1109/EPEPS.2018.8534270
Degerstrom, Michael J. ; White, Christopher K. ; Gilbert, Barry Kent ; Haider, Clifton R. / Modeling Metal Surface Roughness with a Single Parameter. EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 249-251
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