Modeling Metal Surface Roughness with a Single Parameter

Michael J. Degerstrom; Christopher K. White; Barry Kent Gilbert; Clifton R Haider

doi:10.1109/EPEPS.2018.8534270

Modeling Metal Surface Roughness with a Single Parameter

Michael J. Degerstrom, Christopher K. White, Barry Kent Gilbert, Clifton R Haider

Physiology & Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surface roughness.

Original language	English (US)
Title of host publication	EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	249-251
Number of pages	3
ISBN (Electronic)	9781538693032
DOIs	https://doi.org/10.1109/EPEPS.2018.8534270
State	Published - Nov 13 2018
Event	27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018 - San Jose, United States Duration: Oct 14 2018 → Oct 17 2018

Other

Other	27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018
Country/Territory	United States
City	San Jose
Period	10/14/18 → 10/17/18

Keywords

Hexagonal close-packed spheres
Surface roughness
Transmission line

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPEPS.2018.8534270

Cite this

Modeling Metal Surface Roughness with a Single Parameter. / Degerstrom, Michael J.; White, Christopher K.; Gilbert, Barry Kent et al.
EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. p. 249-251 8534270.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Degerstrom, MJ, White, CK, Gilbert, BK & Haider, CR 2018, Modeling Metal Surface Roughness with a Single Parameter. in EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems., 8534270, Institute of Electrical and Electronics Engineers Inc., pp. 249-251, 27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018, San Jose, United States, 10/14/18. https://doi.org/10.1109/EPEPS.2018.8534270

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title = "Modeling Metal Surface Roughness with a Single Parameter",

abstract = "Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surface roughness.",

keywords = "Hexagonal close-packed spheres, Surface roughness, Transmission line",

author = "Degerstrom, {Michael J.} and White, {Christopher K.} and Gilbert, {Barry Kent} and Haider, {Clifton R}",

year = "2018",

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doi = "10.1109/EPEPS.2018.8534270",

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booktitle = "EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems",

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N2 - Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surface roughness.

AB - Conductor surface roughness loss models typically use two physical parameters to vary losses. A similar model was developed that required a single parameter so that the model could alternatively be defined to have a specific loss attributed to surface roughness.

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BT - EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems

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Y2 - 14 October 2018 through 17 October 2018

ER -

Modeling Metal Surface Roughness with a Single Parameter

Abstract

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Keywords

ASJC Scopus subject areas

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