MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems

areas for development

Barry Kent Gilbert, Guang Wen Pan

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

This paper will review the manner in which electronic packaging will be driven by the high-level performance requirements of next-generation mixed-signal systems, and by the evolving characteristics of next-generation integrated circuits. Present performance and fabrication limitations of the multichip module (MCM) technology will be discussed, as well as possible approaches to remove or minimize these constraints. Areas fruitful for research by the simulation community will be noted. This review is intended to provide a broad applications-oriented framework for the theoretical and simulation-directed papers in this special issue on interconnect and packaging.

Original languageEnglish (US)
Pages (from-to)1819-1835
Number of pages17
JournalIEEE Transactions on Microwave Theory and Techniques
Volume45
Issue number10 PART 2
DOIs
StatePublished - 1997

Fingerprint

Multichip modules
packaging
clocks
Clocks
Packaging
modules
electronic packaging
Signal systems
Electronics packaging
electronics
integrated circuits
Integrated circuits
simulation
Fabrication
requirements
fabrication

Keywords

  • Aid converters
  • Digital receivers
  • Digital-signal processors
  • Electromagnetic modeling
  • Multichip modules
  • S-parameters

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

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