Interconnect analysis for 80-Gbps serial link design

Jonathan Fasig; Gregory Rash; Barbara Randall; Karl Fritz; Steven Currie; Bart McCoy; Paul Riemer; Wendy Wilkins; Barry Gilbert; Erik Daniel

doi:10.4071/1551-4897-5.3.135

Interconnect analysis for 80-Gbps serial link design

Jonathan Fasig, Gregory Rash, Barbara Randall, Karl Fritz, Steven Currie, Bart McCoy, Paul Riemer, Wendy Wilkins, Barry Gilbert, Erik Daniel

Physiology & Biomedical Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents a case study of the modeling and simulation methods used to design the signal path for a proposed 80-Gbps serial data link between digital systems. This design includes flip-chip transitions from custom IBM 8HP integrated circuits to multilayer organic substrates, with coaxial-cable connections between substrates. Discussion topics include interconnect material selection, detailed 3-D electromagnetic modeling of the conductor transitions and signal paths, time-domain circuit simulation of the complete data path including the driver and receiver, and bit-error rate analysis of the complete link. Simulated data are presented.

Original language	English (US)
Pages (from-to)	135-139
Number of pages	5
Journal	Journal of Microelectronics and Electronic Packaging
Volume	5
Issue number	3
DOIs	https://doi.org/10.4071/1551-4897-5.3.135
State	Published - 2008

Keywords

Electromagnetic modeling
Flip-chip
Serial data link

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Computer Networks and Communications
Electrical and Electronic Engineering

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10.4071/1551-4897-5.3.135

Cite this

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AU - Fasig, Jonathan

AU - Rash, Gregory

AU - Randall, Barbara

AU - Fritz, Karl

AU - Currie, Steven

AU - McCoy, Bart

AU - Riemer, Paul

AU - Wilkins, Wendy

AU - Gilbert, Barry

AU - Daniel, Erik

PY - 2008

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N2 - This paper presents a case study of the modeling and simulation methods used to design the signal path for a proposed 80-Gbps serial data link between digital systems. This design includes flip-chip transitions from custom IBM 8HP integrated circuits to multilayer organic substrates, with coaxial-cable connections between substrates. Discussion topics include interconnect material selection, detailed 3-D electromagnetic modeling of the conductor transitions and signal paths, time-domain circuit simulation of the complete data path including the driver and receiver, and bit-error rate analysis of the complete link. Simulated data are presented.

AB - This paper presents a case study of the modeling and simulation methods used to design the signal path for a proposed 80-Gbps serial data link between digital systems. This design includes flip-chip transitions from custom IBM 8HP integrated circuits to multilayer organic substrates, with coaxial-cable connections between substrates. Discussion topics include interconnect material selection, detailed 3-D electromagnetic modeling of the conductor transitions and signal paths, time-domain circuit simulation of the complete data path including the driver and receiver, and bit-error rate analysis of the complete link. Simulated data are presented.

KW - Electromagnetic modeling

KW - Flip-chip

KW - Serial data link

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Interconnect analysis for 80-Gbps serial link design

Abstract

Keywords

ASJC Scopus subject areas

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