High-frequency performance of GE high-density interconnect modules

T. R. Haller, B. S. Whitmore, P. J. Zabinski, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components Conference
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages136-143
Number of pages8
ISBN (Print)0818626607
StatePublished - Jan 1992
EventProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
Duration: May 18 1992May 20 1992

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period5/18/925/20/92

Fingerprint

Crosstalk
Insertion losses
Transmission line theory
Permittivity
Systems analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Haller, T. R., Whitmore, B. S., Zabinski, P. J., & Gilbert, B. K. (1992). High-frequency performance of GE high-density interconnect modules. In Proceedings - Electronic Components Conference (pp. 136-143). Piscataway, NJ, United States: Publ by IEEE.

High-frequency performance of GE high-density interconnect modules. / Haller, T. R.; Whitmore, B. S.; Zabinski, P. J.; Gilbert, Barry Kent.

Proceedings - Electronic Components Conference. Piscataway, NJ, United States : Publ by IEEE, 1992. p. 136-143.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Haller, TR, Whitmore, BS, Zabinski, PJ & Gilbert, BK 1992, High-frequency performance of GE high-density interconnect modules. in Proceedings - Electronic Components Conference. Publ by IEEE, Piscataway, NJ, United States, pp. 136-143, Proceedings of the 42nd Electronic Components and Technology Conference, San Diego, CA, USA, 5/18/92.
Haller TR, Whitmore BS, Zabinski PJ, Gilbert BK. High-frequency performance of GE high-density interconnect modules. In Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE. 1992. p. 136-143
Haller, T. R. ; Whitmore, B. S. ; Zabinski, P. J. ; Gilbert, Barry Kent. / High-frequency performance of GE high-density interconnect modules. Proceedings - Electronic Components Conference. Piscataway, NJ, United States : Publ by IEEE, 1992. pp. 136-143
@inproceedings{f6fa82c5a236464ea81f89639876c2fa,
title = "High-frequency performance of GE high-density interconnect modules",
abstract = "An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.",
author = "Haller, {T. R.} and Whitmore, {B. S.} and Zabinski, {P. J.} and Gilbert, {Barry Kent}",
year = "1992",
month = "1",
language = "English (US)",
isbn = "0818626607",
pages = "136--143",
booktitle = "Proceedings - Electronic Components Conference",
publisher = "Publ by IEEE",

}

TY - GEN

T1 - High-frequency performance of GE high-density interconnect modules

AU - Haller, T. R.

AU - Whitmore, B. S.

AU - Zabinski, P. J.

AU - Gilbert, Barry Kent

PY - 1992/1

Y1 - 1992/1

N2 - An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.

AB - An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (>500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.

UR - http://www.scopus.com/inward/record.url?scp=0026677921&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0026677921&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0026677921

SN - 0818626607

SP - 136

EP - 143

BT - Proceedings - Electronic Components Conference

PB - Publ by IEEE

CY - Piscataway, NJ, United States

ER -