FAST-Net optical interconnection prototype characterization

M. W. Haney, M. P. Christensen, P. Milojkovic, J. Rieve, J. Ekman, P. Chandramani, F. Kiamilev, Y. Liu, M. Hibbs-Brenner, E. Strzelecka, G. Fokken, M. Vickberg, B. Gilbert

Research output: Contribution to conferencePaper

Abstract

This paper reports progress toward the experimental evaluation of the smart pixel based optical interconnection demonstrator currently being developed under the Free-space Accelerator for Switching Terabit Networks (FAST-Net) project. The prototype data switching system incorporates 2-D monolithic arrays of high-bandwidth vertical cavity surface emitting lasers (VCSELs) and photodetectors (PDs) that are solder bump bonded to CMOS circuits. The CMOS circuitry provides the high-speed drivers and receivers, control, and interface functions for the smart pixels. The integrated smart pixel arrays are distributed across a multi-chip substrate. A reflective optical system effects a global interconnection pattern across the multi-chip array by imaging clusters of VCSELs onto clusters of PDs. VCSEL/PD pairs are arrayed in a clustered format with a closest pitch of 250 μm. To achieve the required density and registration accuracy, the smart pixel arrays are positioned on the multi-chip substrate to a 10 μm registration tolerance. The optical system is similarly aligned to achieve 10 μm registration accuracy for the VCSEL/PD cluster images. The packaging issues and approach associated with the prototype are reviewed in this paper. The results suggest that a multi-Terabit/sec optically interconnected switch module is feasible.

Original languageEnglish (US)
Pages1/-
StatePublished - Dec 1 1999
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: Jun 13 1999Jun 19 1999

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period6/13/996/19/99

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Haney, M. W., Christensen, M. P., Milojkovic, P., Rieve, J., Ekman, J., Chandramani, P., Kiamilev, F., Liu, Y., Hibbs-Brenner, M., Strzelecka, E., Fokken, G., Vickberg, M., & Gilbert, B. (1999). FAST-Net optical interconnection prototype characterization. 1/-. Paper presented at InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', Maui, HI, USA, .