Enhancement of ultrasonically induced cell transfection with artificial cavitation nuclei

William J. Greenleaf, Mark E. Bolander, Gobinda Sarkar, Mary B. Goldring, James F Greenleaf

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrasound mediated gene transfection in cultured immortalized human chondrocytes was enhanced three-fold using artificial cavitation nuclei in the form of Albunex. 1.0 MHz ultrasound transmitted through the bottoms of six-well culture plates containing media with green fluorescent protein reporter gene plasmids at a concentration of 40 pg/ml and Albunex at 50×10 6 bubbles/ml, exhibited a peak transfection efficiency of about 50% of the living cells when exposed to 4×10 5 Pascals spatial average peak pressure (SAPP) for 20 minutes. Using these parameters, transfection efficiency increased linearly with ultrasound exposure pressure with a transfection threshold observed at a SAPP of 10 5 Pascals. Adding fresh Albunex at 50×10 6 bubbles/ml prior to sequential one second 3.2 or 4.0×10 5 Pascal exposures increased transfection efficiency by 15% for each of three consecutive exposures. Efficient in vitro and perhaps in vivo transfection appears possible with ultrasound.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Ultrasonics Symposium
EditorsS.C. Schneider, M. Levy, B.R. McAvoy
PublisherIEEE
Pages1365-1369
Number of pages5
Volume2
StatePublished - 1997
EventProceedings of the 1997 IEEE Ultrasonics Symposium. Part 1 (of 2) - Toronto, Can
Duration: Oct 5 1997Oct 8 1997

Other

OtherProceedings of the 1997 IEEE Ultrasonics Symposium. Part 1 (of 2)
CityToronto, Can
Period10/5/9710/8/97

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Greenleaf, W. J., Bolander, M. E., Sarkar, G., Goldring, M. B., & Greenleaf, J. F. (1997). Enhancement of ultrasonically induced cell transfection with artificial cavitation nuclei. In S. C. Schneider, M. Levy, & B. R. McAvoy (Eds.), Proceedings of the IEEE Ultrasonics Symposium (Vol. 2, pp. 1365-1369). IEEE.