TY - JOUR
T1 - Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications
T2 - Dependence on advanced electronic packaging to adhieve full performance
AU - Gilbert, Barry K.
AU - Degerstrom, Michael J.
AU - Zabinski, J.
AU - Schaefer, Timothy M.
AU - Fokken, Gregg J.
AU - Randall, Barbara A.
AU - Schwab, Daniel J.
AU - Daniel, Erik S.
AU - Scott, C.
N1 - Funding Information:
Manuscript received May 31, 2000; revised November 9, 2000. This work was supported in part by the Microsystems Technology Office of the Defense Advanced Research Projects Agency (DARPA/MTO) and by the Air Force Research Laboratory (Wright Site) under Contract N66001-99-C-8605 from SPAWAR Systems Center, San Diego.
PY - 2001
Y1 - 2001
N2 - A revolution is occurring in several device and integrated circuit technologies (silicon CMOS and its extensions such as silicon germanium and silicon on insulator [SOI], and the so-called I1I-V compound semiconductors including indium phosphide and gallium arsenide), as well as in solid-state sensors such as infrared detectors enabled by the new materials and devices. These new components are being used to enhance she performance of many systems, and even to create systems never before available, of present interest to the U.S. Department of Defense and of likely near-term interest to parts of the commercial electronics industrysuch as the landline, wireless, and satellite telecommunications industry. These new components require advanced electronic packaging that does not restrict or degrade their performance. Unfortunately, largely due to commercial cost pressures, research in and small-lot manufacture of high-performance packaging, though still feasible and not lacking for good ideas for possible enhancement, are no longer being actively pursued either by the principal U.S. government agencies (e.g., DARPA, Air Force), by the commercial electronic packaging industry, or by commercial consortia such as the Microelectronics and Computer Technology Corporation (defunct as of June 2000), Semiconductor Research Corporation (SRC), or Sematech Inc. [1], [2]. This paper discusses recent examples of high-performance components and integrated circuit technologies and describes how they are being exploited in new or upgraded systems. Advances in packaging technology that will be required to support the new integrated circuits are also described. In conclusion, several possible approaches are reviewed by which the United States can regain momentum in the development of performance-driven packaging technologies.
AB - A revolution is occurring in several device and integrated circuit technologies (silicon CMOS and its extensions such as silicon germanium and silicon on insulator [SOI], and the so-called I1I-V compound semiconductors including indium phosphide and gallium arsenide), as well as in solid-state sensors such as infrared detectors enabled by the new materials and devices. These new components are being used to enhance she performance of many systems, and even to create systems never before available, of present interest to the U.S. Department of Defense and of likely near-term interest to parts of the commercial electronics industrysuch as the landline, wireless, and satellite telecommunications industry. These new components require advanced electronic packaging that does not restrict or degrade their performance. Unfortunately, largely due to commercial cost pressures, research in and small-lot manufacture of high-performance packaging, though still feasible and not lacking for good ideas for possible enhancement, are no longer being actively pursued either by the principal U.S. government agencies (e.g., DARPA, Air Force), by the commercial electronic packaging industry, or by commercial consortia such as the Microelectronics and Computer Technology Corporation (defunct as of June 2000), Semiconductor Research Corporation (SRC), or Sematech Inc. [1], [2]. This paper discusses recent examples of high-performance components and integrated circuit technologies and describes how they are being exploited in new or upgraded systems. Advances in packaging technology that will be required to support the new integrated circuits are also described. In conclusion, several possible approaches are reviewed by which the United States can regain momentum in the development of performance-driven packaging technologies.
KW - Antimonide transistors
KW - CMOS on oxide
KW - HBTs
KW - Indium phosphide
KW - MEMS components and optoelectronic packaging
KW - Multichip modules
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U2 - 10.1109/5.920576
DO - 10.1109/5.920576
M3 - Article
AN - SCOPUS:0042893816
SN - 0018-9219
VL - 89
SP - 426
EP - 442
JO - Proceedings of the IEEE
JF - Proceedings of the IEEE
IS - 4
ER -