Diuretic renal scintigraphy in patients with sulfonamide allergies: Possible alternative use of ethacrynic acid

Ba D. Nguyen, Michael C. Roarke, Jason Robert Young, Ming Yang, Howard H. Osborn

Research output: Contribution to journalArticle

Abstract

Furosemide may trigger life-threatening sulfonamide crosshypersensitivity reactions, posing a dilemma in patients who need diuretic renal scintigraphy. Methods: We present our experience using ethacrynic acid as a nonsulfonamide alternative diuretic in 5 patients, with a discussion of the diuretic molecular structure, potential side effects, protocol development, and imaging results. Results: Diuretic renal scintigraphy using ethacrynic acid provided useful information about the obstruction status in all patients, with no adverse clinical impact. Conclusion: Ethacrynic acid is a potential alternative to furosemide for patients with severe sulfonamide reactions.

Original languageEnglish (US)
Pages (from-to)239-241
Number of pages3
JournalJournal of nuclear medicine technology
Volume43
Issue number4
DOIs
StatePublished - Jan 1 2015

Fingerprint

Ethacrynic Acid
Sulfonamides
Diuretics
Radionuclide Imaging
Hypersensitivity
Kidney
Furosemide
Molecular Structure

Keywords

  • Diuretic renal scintigraphy
  • Ethacrynic acid
  • Sulfonamide allergy

ASJC Scopus subject areas

  • Radiological and Ultrasound Technology
  • Radiology Nuclear Medicine and imaging

Cite this

Diuretic renal scintigraphy in patients with sulfonamide allergies : Possible alternative use of ethacrynic acid. / Nguyen, Ba D.; Roarke, Michael C.; Young, Jason Robert; Yang, Ming; Osborn, Howard H.

In: Journal of nuclear medicine technology, Vol. 43, No. 4, 01.01.2015, p. 239-241.

Research output: Contribution to journalArticle

Nguyen, Ba D. ; Roarke, Michael C. ; Young, Jason Robert ; Yang, Ming ; Osborn, Howard H. / Diuretic renal scintigraphy in patients with sulfonamide allergies : Possible alternative use of ethacrynic acid. In: Journal of nuclear medicine technology. 2015 ; Vol. 43, No. 4. pp. 239-241.
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