Creating neural 'co-processors' to explore treatments for neurological disorders

Scott Stanslaski, Jeffrey Herron, Elizabeth Fehrmann, Rob Corey, Heather Orser, Enrico Opri, Vaclav Kremen, Benjamin Brinkmann, Aysegul Gunduz, Kelly Foote, Gregory Alan Worrell, Tim Denison

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

While first-generation implantable systems exist today that modulate the nervous system, there is a critical need for advancing neurotechnology to better serve patient populations. The convergence of neuroscience and technologies in circuits, algorithms, and energy transfer methods, combined with the growing burden of neurological diseases, make this a timely opportunity. Significantly improving systems arguably requires more than an incremental advancement of 'deep brain stimulation;' we propose a fundamental shift in mindset in how engineered bioelectronic systems are interfaced with the body to treat disease.

Original languageEnglish (US)
Title of host publication2018 IEEE International Solid-State Circuits Conference, ISSCC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages460-462
Number of pages3
Volume61
ISBN (Electronic)9781509049394
DOIs
StatePublished - Mar 8 2018
Event65th IEEE International Solid-State Circuits Conference, ISSCC 2018 - San Francisco, United States
Duration: Feb 11 2018Feb 15 2018

Other

Other65th IEEE International Solid-State Circuits Conference, ISSCC 2018
CountryUnited States
CitySan Francisco
Period2/11/182/15/18

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Stanslaski, S., Herron, J., Fehrmann, E., Corey, R., Orser, H., Opri, E., Kremen, V., Brinkmann, B., Gunduz, A., Foote, K., Worrell, G. A., & Denison, T. (2018). Creating neural 'co-processors' to explore treatments for neurological disorders. In 2018 IEEE International Solid-State Circuits Conference, ISSCC 2018 (Vol. 61, pp. 460-462). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2018.8310383