Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

R. W. Techentin; G. T. Lei; A. J. Staniszewski; G. W. Pan; D. J. Schwab; B. K. Gilbert

Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

R. W. Techentin, G. T. Lei, A. J. Staniszewski, G. W. Pan, D. J. Schwab, B. K. Gilbert

Physiology & Biomedical Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

Original language	English (US)
Number of pages	1
Journal	CPEM Digest (Conference on Precision Electromagnetic Measurements)
State	Published - Dec 1 1994
Event	Proceedings of the 1994 Conference on Precision Electromagnetic Measurements - Boulder, CO, USA Duration: Jun 27 1994 → Jul 1 1994

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Instrumentation
Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance'. Together they form a unique fingerprint.

Cite this

Techentin, R. W., Lei, G. T., Staniszewski, A. J., Pan, G. W., Schwab, D. J., & Gilbert, B. K. (1994). Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. CPEM Digest (Conference on Precision Electromagnetic Measurements).

Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. / Techentin, R. W.; Lei, G. T.; Staniszewski, A. J. et al.
In: CPEM Digest (Conference on Precision Electromagnetic Measurements), 01.12.1994.

Research output: Contribution to journal › Conference article › peer-review

@article{fa8a9d42295d4e9ab3bfc0ca9c2e7a38,

title = "Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance",

abstract = "High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.",

author = "Techentin, {R. W.} and Lei, {G. T.} and Staniszewski, {A. J.} and Pan, {G. W.} and Schwab, {D. J.} and Gilbert, {B. K.}",

year = "1994",

month = dec,

day = "1",

language = "English (US)",

journal = "CPEM Digest (Conference on Precision Electromagnetic Measurements)",

issn = "0589-1485",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1994 Conference on Precision Electromagnetic Measurements ; Conference date: 27-06-1994 Through 01-07-1994",

}

TY - JOUR

T1 - Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards

T2 - Proceedings of the 1994 Conference on Precision Electromagnetic Measurements

AU - Techentin, R. W.

AU - Lei, G. T.

AU - Staniszewski, A. J.

AU - Pan, G. W.

AU - Schwab, D. J.

AU - Gilbert, B. K.

PY - 1994/12/1

Y1 - 1994/12/1

N2 - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

AB - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

UR - http://www.scopus.com/inward/record.url?scp=0028564393&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028564393&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0028564393

SN - 0589-1485

JO - CPEM Digest (Conference on Precision Electromagnetic Measurements)

JF - CPEM Digest (Conference on Precision Electromagnetic Measurements)

Y2 - 27 June 1994 through 1 July 1994

ER -

Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

Abstract

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this