Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

R. W. Techentin, G. T. Lei, A. J. Staniszewski, G. W. Pan, D. J. Schwab, Barry Kent Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

Original languageEnglish (US)
Title of host publicationCPEM Digest (Conference on Precision Electromagnetic Measurements)
PublisherIEEE
Pages142
Number of pages1
StatePublished - 1994
EventProceedings of the 1994 Conference on Precision Electromagnetic Measurements - Boulder, CO, USA
Duration: Jun 27 1994Jul 1 1994

Other

OtherProceedings of the 1994 Conference on Precision Electromagnetic Measurements
CityBoulder, CO, USA
Period6/27/947/1/94

Fingerprint

Multichip modules
printed circuits
circuit boards
inductance
Printed circuit boards
Inductance
modules
electromagnetism
problem solving
simulation
Networks (circuits)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Techentin, R. W., Lei, G. T., Staniszewski, A. J., Pan, G. W., Schwab, D. J., & Gilbert, B. K. (1994). Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. In CPEM Digest (Conference on Precision Electromagnetic Measurements) (pp. 142). IEEE.

Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards : Simulation and measurement of power plane noise and internal inductance. / Techentin, R. W.; Lei, G. T.; Staniszewski, A. J.; Pan, G. W.; Schwab, D. J.; Gilbert, Barry Kent.

CPEM Digest (Conference on Precision Electromagnetic Measurements). IEEE, 1994. p. 142.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Techentin, RW, Lei, GT, Staniszewski, AJ, Pan, GW, Schwab, DJ & Gilbert, BK 1994, Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. in CPEM Digest (Conference on Precision Electromagnetic Measurements). IEEE, pp. 142, Proceedings of the 1994 Conference on Precision Electromagnetic Measurements, Boulder, CO, USA, 6/27/94.
Techentin RW, Lei GT, Staniszewski AJ, Pan GW, Schwab DJ, Gilbert BK. Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. In CPEM Digest (Conference on Precision Electromagnetic Measurements). IEEE. 1994. p. 142
Techentin, R. W. ; Lei, G. T. ; Staniszewski, A. J. ; Pan, G. W. ; Schwab, D. J. ; Gilbert, Barry Kent. / Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards : Simulation and measurement of power plane noise and internal inductance. CPEM Digest (Conference on Precision Electromagnetic Measurements). IEEE, 1994. pp. 142
@inproceedings{fa8a9d42295d4e9ab3bfc0ca9c2e7a38,
title = "Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance",
abstract = "High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.",
author = "Techentin, {R. W.} and Lei, {G. T.} and Staniszewski, {A. J.} and Pan, {G. W.} and Schwab, {D. J.} and Gilbert, {Barry Kent}",
year = "1994",
language = "English (US)",
pages = "142",
booktitle = "CPEM Digest (Conference on Precision Electromagnetic Measurements)",
publisher = "IEEE",

}

TY - GEN

T1 - Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards

T2 - Simulation and measurement of power plane noise and internal inductance

AU - Techentin, R. W.

AU - Lei, G. T.

AU - Staniszewski, A. J.

AU - Pan, G. W.

AU - Schwab, D. J.

AU - Gilbert, Barry Kent

PY - 1994

Y1 - 1994

N2 - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

AB - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

UR - http://www.scopus.com/inward/record.url?scp=0028564393&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028564393&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0028564393

SP - 142

BT - CPEM Digest (Conference on Precision Electromagnetic Measurements)

PB - IEEE

ER -