Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

R. W. Techentin, G. T. Lei, A. J. Staniszewski, G. W. Pan, D. J. Schwab, B. K. Gilbert

Research output: Contribution to journalConference article

Abstract

High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

Original languageEnglish (US)
Number of pages1
JournalCPEM Digest (Conference on Precision Electromagnetic Measurements)
StatePublished - Dec 1 1994
EventProceedings of the 1994 Conference on Precision Electromagnetic Measurements - Boulder, CO, USA
Duration: Jun 27 1994Jul 1 1994

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Electrical and Electronic Engineering

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