An overlay interconnect technology for 1 GHz and above MCMs

M. Gdula, W. P. Kornrumpf, B. K. Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

An overlay interconnect technology is presented that is suitable for 1 GHz and above operation of GaAs and Si multichip module (MCM) circuits. This technology encompasses a back side bonded, chips first approach with an adaptive laser photolithography defined multilayer overlay interconnect providing consistent line impedances with low crosstalk and signal delay. Signal propagation velocities of 18 cm/ns have been demonstrated on lines with an insertion loss of 0.25 dB/cm at 10 GHz. This interconnect system has been used to interconnect GaAs digital circuits operating at clock frequencies of 2.0 GHz without power supply bypass capacitors.

Original languageEnglish (US)
Title of host publicationProceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages171-174
Number of pages4
ISBN (Electronic)0818627255, 9780818627255
DOIs
StatePublished - Jan 1 1992
Event1992 IEEE Multi-Chip Module Conference, MCMC 1992 - Santa Cruz, United States
Duration: Mar 18 1992Mar 20 1992

Publication series

NameProceedings 1992 IEEE Multi-Chip Module Conference MCMC-92

Conference

Conference1992 IEEE Multi-Chip Module Conference, MCMC 1992
CountryUnited States
CitySanta Cruz
Period3/18/923/20/92

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Gdula, M., Kornrumpf, W. P., & Gilbert, B. K. (1992). An overlay interconnect technology for 1 GHz and above MCMs. In Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92 (pp. 171-174). [201477] (Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MCMC.1992.201477