Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates

B. Gilbert, R. Thompson, G. Fokken, W. McNeff, J. Prentice, D. Rowlands, A. Staniszewski, W. Walters, S. Zahn, G. W. Pan

Research output: Contribution to journalConference article

6 Scopus citations
Original languageEnglish (US)
Pages (from-to)235-248
Number of pages14
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1390
DOIs
StatePublished - Apr 1 1991
EventMicroelectronic Interconnects and Packages: System and Process Integration 1990 - Boston, United States
Duration: Nov 4 1990Nov 9 1990

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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