Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates

B. Gilbert; R. Thompson; G. Fokken; W. McNeff; J. Prentice; D. Rowlands; A. Staniszewski; W. Walters; S. Zahn; G. W. Pan

doi:10.1117/12.25580

Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates

B. Gilbert, R. Thompson, G. Fokken, W. McNeff, J. Prentice, D. Rowlands, A. Staniszewski, W. Walters, S. Zahn, G. W. Pan

Physiology & Biomedical Engineering

Research output: Contribution to journal › Conference article › peer-review

6 Scopus citations

Original language	English (US)
Pages (from-to)	235-248
Number of pages	14
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	1390
DOIs	https://doi.org/10.1117/12.25580
State	Published - Apr 1 1991
Event	Microelectronic Interconnects and Packages: System and Process Integration 1990 - Boston, United States Duration: Nov 4 1990 → Nov 9 1990

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.25580

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Gilbert, B., Thompson, R., Fokken, G., McNeff, W., Prentice, J., Rowlands, D., Staniszewski, A., Walters, W., Zahn, S., & Pan, G. W. (1991). Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates. Proceedings of SPIE - The International Society for Optical Engineering, 1390, 235-248. https://doi.org/10.1117/12.25580

Gilbert, B, Thompson, R, Fokken, G, McNeff, W, Prentice, J, Rowlands, D, Staniszewski, A, Walters, W, Zahn, S & Pan, GW 1991, 'Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates', Proceedings of SPIE - The International Society for Optical Engineering, vol. 1390, pp. 235-248. https://doi.org/10.1117/12.25580

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AU - Gilbert, B.

AU - Thompson, R.

AU - Fokken, G.

AU - McNeff, W.

AU - Prentice, J.

AU - Rowlands, D.

AU - Staniszewski, A.

AU - Walters, W.

AU - Zahn, S.

AU - Pan, G. W.

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JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Microelectronic Interconnects and Packages: System and Process Integration 1990

Y2 - 4 November 1990 through 9 November 1990

ER -

Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates

ASJC Scopus subject areas

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