A zero sum signaling method for high speed, dense parallel bus communications

Chad M. Smutzer, Robert W. Techentin, Michael J. Degerstrom, Barry K. Gilbert, Erik S. Daniel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Complex digital systems such as high performance computers (HPCs) make extensive use of high-speed electrical interconnects, in routing signals among processing elements, or between processing elements and memory. Despite increases in serializer/deserializer (SerDes) and memory interface speeds, there is demand for higher bandwidth busses in constrained physical spaces which still mitigate simultaneous switching noise (SSN). The concept of zero sum signaling utilizes coding across a data bus to allow the use of single-ended buffers while still mitigating SSN, thereby reducing the number of physical channels (e.g. circuit board traces) by nearly a factor of two when compared with traditional differential signaling. Through simulation and analysis of practical (non-ideal) data bus and power delivery network architectures, we demonstrate the feasibility of zero sum signaling and compare performance with that of traditional (single-ended and differential) methods.

Original languageEnglish (US)
Title of host publicationDesignCon 2012
Subtitle of host publicationWhere Chipheads Connect
Pages896-919
Number of pages24
StatePublished - Dec 1 2012
EventDesignCon 2012: Where Chipheads Connect - Santa Clara, CA, United States
Duration: Jan 30 2012Feb 2 2012

Publication series

NameDesignCon 2012: Where Chipheads Connect
Volume2

Other

OtherDesignCon 2012: Where Chipheads Connect
CountryUnited States
CitySanta Clara, CA
Period1/30/122/2/12

ASJC Scopus subject areas

  • Hardware and Architecture

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  • Cite this

    Smutzer, C. M., Techentin, R. W., Degerstrom, M. J., Gilbert, B. K., & Daniel, E. S. (2012). A zero sum signaling method for high speed, dense parallel bus communications. In DesignCon 2012: Where Chipheads Connect (pp. 896-919). (DesignCon 2012: Where Chipheads Connect; Vol. 2).