A Flip-chip attach method for dense, moderate pin count, high speed (80+ Gbps) interconnects

W. L. Wilkin, M. J. Lorsung, J. E. Bublitz, B. A. Randall, J. L. Fasig, E. S. Daniel, B. K. Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

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Engineering & Materials Science